Do not rely on outdated summaries or illegal copies. In the world of hidden solder joints, the IPC-7093A is your only reliable guide.
Using specialized hot-air rework stations to avoid overheating adjacent sensitive components.
While IPC-A-610 generally establishes a 25% voiding limit for standard surface-mount joints, IPC-7093A provides nuanced context for BTC thermal pads. It discusses how void size, location (e.g., a single large void vs. multiple small voids), and proximity to thermal vias impact heat dissipation and mechanical reliability. Rework Best Practices
If you work with QFN or DFN packages, the belongs on your digital bookshelf.
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The standard specifically applies to components with planar terminations under the body, with or without wettable side terminations. Common examples of BTCs include:
Published in October 2020 by IPC, IPC-7093A is a complete overhaul of the original IPC-7093 standard. It provides updated, in-depth guidelines for the of components with termination pads underneath the package body, such as QFNs (Quad Flat No-leads), DFNs (Dual Flat No-leads), and SONs (Small Outline No-leads).
Common package types covered extensively under the IPC-7093A guideline include QFN, DFN, SON, LGA, and MLP. Core Focus Areas of IPC-7093A
To stay compliant with the latest industry standards, purchasing the official document is highly recommended. ipc-7093a pdf
Because these components feature high functional density and exceptional thermal performance, they have become staples in modern consumer electronics, aerospace systems, and automotive hardware. However, their leadless nature means they lack compliance to absorb thermal expansion stresses, making adherence to IPC-7093A crucial. Key Upgrades in Revision A
Minimizing mechanical stress on leadless joints prevents premature field failures caused by thermal cycling. How to Access IPC-7093A
They pulled up the PDF on the large monitor. Unlike the scattered forum posts, the PDF was structured with the precision of a legal text. It wasn't just about how to solder; it was about how to design the board so it could be soldered reliably.
Assembling BTCs requires tight process control during placement and reflow. IPC-7093A provides operational guardrails for contract manufacturers (CMs). Component Placement Accuracy Do not rely on outdated summaries or illegal copies
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Defining solder mask openings (SMD vs. NSMD) to prevent bridging and ensure proper solder joint formation.
: Updated recommendations for land patterns and solder mask defined pads to prevent solder from flowing down open via holes during reflow.
Since BTC solder joints are hidden beneath the component body, Automated X-ray Inspection (AXI) is required to evaluate joint integrity. While IPC-A-610 generally establishes a 25% voiding limit
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